The ISIG Executive Summit China was held in Shanghai's Lin-gang Special Area from Oct 20 to 21, bringing together more than 150 semiconductor executives to discuss the technological evolution of AI infrastructure and emerging industry opportunities.

ISIG, short for International Semiconductor Industry Group, is a global organization that connects senior leaders across the semiconductor manufacturing ecosystem. Under the theme "Powering the AI Era: Redefining Compute, Connectivity and Energy at Scale", its China summit featured more than 30 keynote speeches and two roundtable discussions.

Salah Nasri, CEO and co-founder of ISIG, delivers an opening speech. [Photo/WeChat ID: shlgguanweihui]

Representatives from AMD, Tongfu Microelectronics, Amkor, Resonac, AT&S, Onto Innovation, and ASMPT shared their latest advances and industry practices across key areas, including heterogeneous integration, advanced packaging, advanced substrates, packaging materials, and silicon photonics.

Lin-gang hosted a dedicated meeting with companies including Adventest, Renesas, onsemi, and Simetric Semiconductor Solutions to discuss investment opportunities, supply chain collaboration, and future industry trends, aiming to foster deeper industrial cooperation.

Lin-gang is accelerating semiconductor development, focusing on key areas such as logic chips, specialty processes, advanced packaging, and next-generation memory. By attracting businesses across the supply chain, it has fostered a closely connected ecosystem spanning chip design, manufacturing, packaging and testing, equipment, and materials.