China's JCET Group – a leading international integrated circuits manufacturer and technology services provider – recently signed up to build an automotive-grade chip packaging and testing base in the Lin-gang Special Area in East China's Shanghai, at an investment promotions event in the city.

The facility's products will cover the four new semiconductor fields of intelligent cockpits, intelligent interconnections, safety sensors, as well as module packaging types – covering traditional packaging and advanced module packaging and systems-level packaging products.

At the same time, the dedicated vehicle chip packaging and testing production plant is expected to help achieve high reliability and high stability requirements for automotive chips.

JCET Group was established in 1972 and listed on the Shanghai Stock Exchange in 2003. It is the first listed company in China's IC packaging and testing industry, as well as the third largest global IC manufacturer and technology service provider.

It has two R&D centers and six IC finished product manufacturing plants in China, South Korea and Singapore.

The settlement of JCET's new project in Lin-gang is expected to help boost Lin-gang's IC packaging and testing capabilities, strengthen the industry supply chain and have a significant impact on promoting the development of the special area's automotive semiconductors industry.

Lin-gang has formed an auto semiconductors ecosystem covering the entire industry chain from materials/equipment, design, manufacturing, packaging testing to applications.